ISTC2008
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- ISTC2001, Shanghai
- ISTC2002, Tokyo
- ISTC2004, Shanghai

- ISTC2005, Shanghai
- ISTC2006, Shanghai
- ISTC2007, Shanghai
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About ISTC
- ISTC Introduction
 

ISTC2001-MAY 27-30, 2001, PUDONG SHANGRI-LA HOTEL, SHANGHAI, CHINA

 
Dr. Jack Kilby,
Year 2000 Nobel Prize Winner and IC inventor, gives his plenary speech at ISTC2001

CONFERENCE SPEAKERS

 

Dr. Jack Kilby, Year 2000 Nobel Prize Winner and IC inventor

Dr. David Wang,
Executive vice President of Applied Materials
"Semiconductor Industry Trends, Future Growth and Opportunities"

Dr. Simon Sze,
National Academy of Engineering
"Microelectronic Technology: Challenges in the 21st Century"

Dr. Yoshio Nishi,
Senior Vice President of Texas Instruments
"Future Research and Development Directions for Semiconductor Industry"

Mr. Gary Dickerson,
KLA-Tencor's chief operating officer
"Yield Challenges of the 0.13 um node and below"

 
CONFERENCE REGISTRATION
Registration Fee In Advance On-site
Regular Registration $350 $395
Student $75 $95
Accompanying Person $75 $95

Completed Registration Forms using block capitals and return to the following address along with payment. The registration form and payment MUST be received by April 30, 2001, to qualify for the advance rates. Make check or money orders payable to The Electrochemical Society, Inc. Payments must be made in U.S. funds drawn on a U.S. Bank. MasterCard or VISA are also accepted (not American Express).

Attendees prepaying by credit card may send their Advance Registration Forms to the Society Headquarters Office by Fax: 609.737.2743. If you send your Advance Registration Form by FAX, please do not send another copy by mail, as this may result in duplicate charges. All Advance Registrations will be confirmed by mail.

The Electrochemical Society,Inc., 65 South Main Street, Pennington, New Jersey 08534-2839 USA
Tel: 609.737.1902 Fax: 609.737.2743 E-mail: swami.mathad@infineon.com

VISA AND TRAVEL INFORMATION

Since you are going to attend the conference and you may tour some other places in China, it will be easier for you just apply for Tourist Visa. If you want to get business visa you need to print out this web pager, invitation letter from this conference along with the visa application to apply for visa. Following table lists the Visa Office of the Chinese Embassy in various countries.
Please send an email to Dr . Swami Mathad at ecs@electrochem.org if you need a invitation letter from China.

USA www.china-embassy.org/eng/c2682.html
France www.amb-chine.fr
UK www.chinese-embassy.org.uk
Finland www.chinaembassy-fi.org
Australia www.chinaembassy.org.au
New Zealand www.chinaembassy.org.nz
ACCOMMODATIONS
The Pudong Shangri-La Hotel - Shanghai is the official headquarters hotel for the ISTC conference. Our special ISTC hotel rates are from $130.00/$140.00 for single/double room with city view and $150.00/$160.00 with Bund view as seen in the above picture. Please download the Hotel reservation form and Fax to 86-21-6882-6688 before April 22, 2001 to ensure your reservation since May in Shanghai is very busy season. Be sure to identify yourself as attending the ISTC conference in order to obtain the our conference special discount rates (Normal Rate for this hotel is about $260 per night).

 

How to get to Shangri-La Hotel from Pudong Airport?
 

There is public Shuttle Bus from Airport to Hotel which cost about 30 Yuan (~ $4) but it has certain schedule. When you come out the airport please check with information desk about the shuttle bus schedule.

The Taxi is also not bad choice. It cost about 140-160 Yuan (~ $20) from airport to Hotel and it takes about 45 minutes. City of Shanghai has very restricted roles to Taxi driver and normally they are very honest.

ISTC conference will have information desk in the airport on 26th to direct you.

 
The Venue
 
Shanghai lies on the west bank of the Huangpu Jiang river, which flows into the Changjiang (Yangtze) 28 km farther upstream. The Wusong Jiang River separates the northern part of Shanghai from the rest of the city. Shanghai is a special city in every aspect. Only 50 years ago, it was considered one of the most important metropolises of the world, as the trading and banking center in Asia. Shanghai found a new takeoff opportunity in 1990s. The opening and development Pudong has pushed Shanghai to forefront of China's economic reform and opening. Through years of tremendous investment input and efforts, Shanghai has called worldwide attention upon its achievements. The blend of view and the wide range of meeting facilities make Pudong an outstanding venue for the ISTC meeting.
 
CONFERENCE ORGANIZERS
 

Chairman

Ming Yang
Silicon Technology Development, MS 3701
Texas Instruments, Inc.
P.O. Box 650311, Dallas, TX 75265 USA
Phone: (972) 995-8289
Fax: (972) 918-9432
E-mail: myang@ti.com

Co-Chairmen

Y. Kuo, Texas A&M University, USA, Phone: (979) 845-9807, E-mail: yuekuo@tamu.edu
G.S. Mathad, Infineon Technologies, Inc., USA, Phone: (914) 892-9533, E-mail: swami.mathad@infineon.com

International Advisory Committee

Carlton M. Osburn  
Masakiyo Matsumura 
Ju-Yan Xu      
Takeo Hattori    
Dennis W. Hess   
Shang-Zhou Jiang   
Zhongrui Xia     
Jin Jang
President of ECS Society
President of Japan Society of Applied Physics
Academician of Chinese Academy of Engineering
Chairman, Division of Silicon-Technologies, JSAP
Professor, Georgia Institute of Technology
Vice Chairman of Shanghai Economic Commission
President of Shanghai Huahong Co. Ltd.
Director, Korea National Laboratory of TFT

International Technical Committee

S. Sze
Takeo Hattori
Jin Jang
Joe McPherson 
Dennis W. Hess 
Ju-Yan Xu
Yangyuan Wang
David Thomas
Wan-Ye Wang
Jian-Hui Ye 
Jiaji Wang
Yoshinobu Mitano
Kobe Nishimura
Jeff Chinn 
Bing-Zong Li
Naihin Lee
Manfred Engelhardt 
Albert Chin
National Academy of Engineering
Musashi Institute of Technology
Korea National Laboratory of TFT
Texas Instruments, Inc., USA
Georgia Institute of Technology
Member of Chinese Academy of Engineering
Academician of Chinese Academy of Science
Trikon Technologies Ltd., UK
Wuxi Center Microelectronics Research Institute
Institute of Materials Research & Engineering, Singapore
Fudan University
TEL Electron LTD.
TEL Electron LTD.
Applied Materials, USA
Fudan University
Applied Material, China
Infineon Technologies, Inc., Germany
National Chiao Tung University, Taiwan

Local Committee

Xiufa Xu
Gao-Wei He
Shanghai Huahong Co. LTD.
Fudan University

Conference Administration

Roque J. Calvo
Elizabeth Brennfleck
Executive Director, The Electrochemical Society
Director of Meetings, Exhibits & On-Line Services, The Electrochemical Society.

The Electrochemical Society, Inc.
65 South Main Street, Pennington, NJ 08534-2839, USA
Phone: (609) 737-1902 Fax: (609) 737-2743
E-mail: ecs@electrochem.org

 
Invited Speakers
 
Jack Kilby
David Wang
Yoshio Nishi
Simon Sze
Gary Dickerson   
Ju-Yan Xu
Yangyuan Wang
Jin Jang
Joe McPherson
C.K. Hu    
George Celler
F. Masuoka    
Mitsumasa Koyanagi 
Bing-Zong Li
Takeo Hattori
N. Koshida 
Calvin Gabriel
Kazuyoshi Ueno  
Yoshihiro Sugita 
Hiroyuki Kageshima  
Manfred Engelhardt  
J. Gambino
Byron Ahlburn   
Jae-Sung Roh
Dick Goldi 
W. Lukaszek 
Kouichirou Tsujita
Tadahiro Takigawa
Albert Chin
F.M. Pan   
S.J. Chang    
S.W. Sun    
Simon Jang   
Chester Dziobkowski   
Satoshi Hamaguchi  
Texas Instruments, Inc., USA
Applied Material, Inc., USA
Texas Instruments, Inc., USA
National Academy of Engineering
KLA-Tencor, USA
Academician of Chinese Academy of Engineering, China
Academician of Chinese Academy of Science, China
Korea National Laboratory of TFT, Korean
Texas Instruments, Inc., USA
IBM, USA
Bell Labs - Luceht Technologies, USA
Tohoku University (Flash Memory inventor), Japan
Tohoku University, Japan
Fudan University, China
Musashi Institute of Technology, Japan
Tokyo University of Agriculture and Technology
Phillips Semiconductor
NEC, Japan
Fujitsu Labs. Ltd, Japan
NTT Basic Research Labs. Japan
Infineon Technologies, Inc. Germany
IBM, USA
Texas Instruments, Inc., USA
HYUNDAI Electronics Industries Co.,Ltd. Korean
Texas Instruments, Inc., USA
Wafer Charging Monitors, Inc, USA
Mitsubishi Electric Corporation, Japan
Toshiba Corporation, Japan
National Chiao Tung University, Taiwan
National Nano Device Lab, Taiwan
Electrical Engineering, National Cheng Kung University, Taiwan
United Microelectronics Corp., (UMC), Taiwan
TSMC, Taiwan
IBM Corporation\\ Semiconductor Development and Research Center
Kyoto University, Japan
 

CONFERENCE SPONSORS

 
Technical Co-Sponsored By
 
 
Conference Sponsors
 
     
 
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