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ISTC2004, SEPTEMBER 15-17, 2004, SHANGHAI, CHINA |
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CONFERENCE PROGRAM |
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Time |
Title |
Speakers |
| 8:55 - 9:00 am |
Introduction |
Professor Bill Milne |
| 9:00 - 9:05 am |
Welcome From Conference Chairman |
Dr. Ming Yang |
| 9:05 - 9:10 am |
Message From Conference Honorable Chairman |
Professor Shi--Chang Zou |
| 9:10 - 9:20 am |
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Shanghai City Official |
| 9:20 - 9:30 am |
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Shanghai Pudong official |
| Plenary Speech |
| 9:30 - 10:00 am |
"The Future Technology for Semiconductor Industry" |
Dr. Randy Issac, Vice President of IBM |
| 10:00 - 10:30 am |
"Environmental Friendly Manufacturing for IC Industry" |
Dr. Richard Chang, President and CEO of SMIC |
| Keynote Speech |
| 10:30 - 11:00 am |
"Technical Challenges towards further scaling technologies below 45nm" |
Dr. Van den hove Luc, Technology Vice President of IMEC |
| 11:00 - 1130 am |
¡°Extending Transistor Scaling and Moore's Law with Nano-technology¡± |
Dr. Robert Chau, Intel Fellow and Director of Transistor Research at Intel Corporation |
| 11:30 - 12:00 am |
"Yield Challenges at the 90nm Technology Node and Beyond" |
Dr. Kevin Monahan, Vice President of KLA-Tencor Corporation |
| Special Banquet Keynote Speech |
| 07:00 - 7:45 pm |
"Interactive Visualization of Data - Impacting Decision-Making In Semiconductor Manufacturing" |
Dr. Christopher Ahlberg, CEO of Spotfire Inc. |
| 13:30 - |
Conference Programs |
Location |
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ISTC2004 Session 1 |
(Auditorium - 1) |
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ISTC2004 Session 2 |
(Auditorium - 2) |
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ISTC2004 Session 3 |
(Auditorium - 3) |
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ISTC2004 Session 4 |
(Auditorium - 4) |
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INVITED SPEAKERS |
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Dr Forin Udrea, Cambridge University
"Trench Technology in Advanced High Voltage Semiconductor Devices"
Prof Julian Gardner, Dean of Engineering of Warwick University
"Neuromorphic Chemical Microsystems: Making a smart tongue and a nose-on-a-chip"
Dr. Ehrenfied Zschech, AMD Saxony,Dresden,Germany
"Investigation of interconnect structures in advanced MPUs for process control andelectromigration related failure analysis"
Dr. Guenther Schindler, Infineon Technologies
"Conductor Systems for Future Technology Generations"
Prof. Shiva-shankar, Indian Institute of Science
"ALD of <111> copper"
Dr. H. Rathore, IBM
"Cu/Low-k reliability"
Dr. Gerfried Zwicker Fraunhofer Institute for Silicon Technology, ISIT, Itzehoe, Germany
"Advanced CMP Technology and Applications"
Dr Daping Chu Seiko-Epsom lab
"Ferroelectric Random Access Memory (FeRAM) Cells and Non-Destructive Read-Out (NDRO)"
Dr. W. Lukaszek, Wafer Charging Monitors, Inc, USA
"Plasma Charging Damage in IC manufacturing"
Dr. Stefan Schulz Chemnitz University of Technology, Chemnitz, Germany
"Advanced CVD Technology for Diffusion Barrier and Copper Deposition"
Dr. Michael A. Fury DuPont EKC Technology, USA
"Post-Etch Cleaning Technology for Copper / Low-k Applications"
Dr. Jin-Goo Park Hanyang University, Korea
"Post Cu CMP Cleaning"
Dr.Tadatomo Suga University of Tokyo
"Surface Activated Bonding for Microelectrnic and MEMS Packaging"
Liu Yuling HeBei University of Technology
"Copper ion complexion on Cu CMP in ULSI"
Dr. Kenji Takahashi Association of Super-Advanced Electronics Technologies (ASET))
"Development of Three-Dimensional Chip Stacking Technology |
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CONFERENCE REGISTRATION |
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Advance Registration |
On-Site |
Regular Registration |
$350 |
$395 |
Student |
$75 |
$95 |
Accompanying Person |
$75 |
$95 |
Completed Registration Forms using block capitals and return to the following address along with payment. The registration form and payment MUST be received by July 30, 2004, to qualify for the advance rates. Make check or money orders payable to The ISTC. Payments must be made in U.S. funds drawn on a U.S. Bank. MasterCard or VISA are also accepted (not American Express). ¡¡
Group deals are available. If your company has more than 10 people attend the conference then it is better to join the group deal. The group deal are:¡¡
(1) For US$ 3700 your company can have up to 20 employees attend the conference.
(2) For US$ 4500 your company employees can attend both conference and one short class.
(3) For US$ 5000 there is no limit number of your company employees to attend both conference and one short class.
Attendees prepaying by credit card may send their Advance Registration Forms to the ECS-ISTC Office by Fax: 86-21-50591606. If you send your Advance Registration Form by FAX, please do not send another copy by mail, as this may result in duplicate charges. All Advance Registrations will be confirmed by E-mail. |
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SHORT COURSES |
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ISTC2004 is going to offer three short courses during the conference
(1) Copper/Low-k Inter-connect Reliability Instructor: Dr. Hazara S. Rathore (IBM)
(2) Plasma Processing Technology Instructor: Dr. Swami Mathad (32 year IBM/Infineon Process experience)
(3) Modern IC Packaging Technology Instructor: Dr. M. Bonkohara ( Association of Super-Advanced Electronics Technologies)
Seats are limited in each course. So please sign up ASAP. If you register for the conference then your registration fee for the class will be US$150/per person. If you only want to attend the class then your registration fee for the class is US$300 (RMB2480)/per person.
Please send an email to ISTC2004@ecsistc.org to register with following information.
Your Name:
Company Name:
Telephone Number:
Which class you want to attend:
Payment Method: |
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CONFERENCE ORGANIZERS |
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Conference Honorable Chairman
Shi-Chang Zou, Member of Chinese Academy of Science
Conference Chairman
Ming Yang
E-mail: myang@ecsistc.org
Conference Co-Chairman
Bill Milne
Technical Program Chairman
G.S. Mathad
Technical Program Co-Chairmen
M. Bonkohara, Association of Super-Advanced Electronics Technologies
M. Engelhardt, Infineon Technologies, AG, Germany
International Advisory Committee
Masakiyo Matsumura, Japan Society of Applied Physics
Prof. H. Iwai, Tokyo Inst. of Technology, Japan
Yangyuan Wang, Academician of Chinese Academy of Science
Ju-Yan Xu, Academician of Chinese Academy of Engineering
Takeo Hattori, Division of Silicon-Technologies, JSAP
Shang-Zhou Jiang, Shanghai Economic Commission
Jin Jang, Director, Korea National Laboratory of TFT
International Technical Committee
S. Sze, National Academy of Engineering
Takeo Hattori, Musashi Institute of Technology
Jin Jang, Korea National Laboratory of TFT
Ju-Yan Xu, Member of Chinese Academy of Engineering
Yangyuan Wang, Academician of Chinese Academy of Science
David Thomas, Trikon Technologies Ltd., UK
Jian-Hui Ye, Institute of Materials Research & Engineering, Singapore
Jiaji Wang, Fudan University
Yoshinobu Mitano, TEL Electron LTD.
Bing-Zong Li, Fudan University
Manfred Engelhardt, Infineon Technologies, Inc., Germany
Albert Chin, National Chiao Tung University, Taiwan
Local Arrangement and Administration
Luning Jiang, ECS-ISTC China Representative
Xinchen Xei, ECS-ISTC China
Xue Zi, Shanghai Integrated Circuit Industry Association |
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THE VENUE |
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The River-Front Hotel-is the official headquarters hotel for the ISTC2004 conference. Our special ISTC2004 hotel rates are from $60.00 for single/double room. Please download the Hotel reservation form and Fax to 86-21-50591606 before July 30, 2004 to ensure your reservation. Be sure to identify yourself as attending the ISTC2004 conference in order to obtain the our conference special discount rates (Normal Rate for this hotel is about $100 per night). |
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How to get to River-Front Hotel from Pudong Airport? |
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Hotel will have Shuttle Bus to pick up the ISTC2004 conference attendants at Pudong International Airport on September 14th and 15th. When you come out the airport please check with information desk about the shuttle bus schedule.
The Taxi is also not bad choice. It cost about ~100 Yuan (~ $12) from airport to Hotel and it takes about 20 - 30 minutes. City of Shanghai has very restricted roles to Taxi driver and normally they are very honest. |
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CO-SPONSORED BY |
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