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ISTC2005, MARRCH 15-17, 2005, SHANGHAI, CHINA

 
EXECUTIVE COMMITTEE
 
Dr. Ming Yang ICRD

Prof.Bill Miline

Cambridge University
Dr.Swami Mathad S/C Tech.Consulting,USA

Prof. H Iwai (Device and Reliabilty Division Chairman)

Tokyo Institute of Technology

Mr. Simon Chang (Photolithography Division Chairman)

Texas Instruments, USA
Dr. Bob Tseng (Maufacturing Science Division Chairman) Vice President of TSMC operation Shanghai
Dr. Ken MacWilliams (Materials & Equipment Chairman) Applied Materials, CTO of Thin film group
Dr.Qingyuan Han (Advanced Process Chairman) Axcelis Technologies, Inc, USA
Dr. Sookap Hahn (CMP Division Chairman) SKW Associates,Inc
Prof.M.koyanagi Tohoku University,Japan
Dr.Sunil Wickramanayaka Anelva Corporation
Prof.Jin Goo Park Hanyang University
Dr.Tomi Li
AMAT, Senior Director
Dr. Michael A. Fury
DuPont EKC Technology,VP R&D and Engineering
Dr. Sheldon Wu Vice President of TSMC
 
SESSIONS COMMITTEE

Session 1
Device, Modeling and Reliability Division
Chairman
Prof.H Iwai Tokyo Institute of Technology,Japan
Committee
Dr.Claeys Cor IMEC,Belgium
Dr.Sunil  Wickramanayaka Anelva Corporation,Japan
Dr.Xingong Wan ICRD
Dr.J. J. Liou Univ. of Central Florida
Dr.Prashant Majhi International Sematech,USA
Dr. Albert Wang Integrated Electronics Laboratory
Session 2
Lithography Division
Chairman
Mr.Simon Chang Texas Instruments,Inc
Committee
Mrs. Marylyn Bennett SEMATCH, US (former SPIE International Symposium Chair)
Mr. Alex Cheng SMIC, China
Dr.Curtis Liang GSMC,Shanghai China
Dr.Cesar Garza Freesca0le

Dr.Mukherjee-Roy Moitreyee       

Institute of Microelectronics, Singapore
Advisory committee:
Mr.Jun Zhu ICRD
Dr.Geert Vandenberghe IMEC,Belgium
Session 3
Materials and Equipment Division
Chairman
Dr.Ken MacWilliams Applied Materials
Committee
Dr.D.P.Chu Cambridge University
Dr. Michael A. Fury DuPont EKC Technology,VP R&D and Engineering
Session 4
Advanced Processing Division
Chairman
Dr.Qingyuan Han Axcelis Technologies,Inc,USA
Co-Chairman
Dr.Mike D.Armacost AMAT
Committee
Dr.Swami Mathad S/C Tech.Consulting,USA
Prof.Bingzong Li Fudan University,China
Dr.Wei Chen Dow Corning
Session 5
Manufacturing Science Division
Chairman
Dr. Tseng TSMC
Committee
Dr. Laith Altimime Kla-Tencor
Session 6
Chemical Mechanical Polishing Technology Division
Chairman
Dr.Sookap Hahn SKW Associates,Inc
Committee
Dr.Wei-yung Hsu AMAT
Dr.Wei-Chung Yu Rohm & Haas Electronic Materials
Mr.Jia Chu ICRD
Dr.Hanming Wu SMIC,China
     
 
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