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About ISTC
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ISTC2007, MARCH 18-20, 2007, SHANGHAI, CHINA

 
COMMITTEE
 
Conference Honorary Chairmen
Prof. Yang-Yuan Wang
Honorary Chairman
Peking University and SMIC
Academician of Chinese Academy of Sciences
Prof. Shi-Chang Zou
Honorary Chairman
GSMC
Academician of Chinese Academy of Sciences
International Advisory Committee
Dr. Ming Yang
Chairman
IC Spectrum, Chairman&CEO, China
Dr. Simon Deleonibus
Member
CEA-LETI, France
Prof. Bill Miline
Member
Cambridge University, England
Prof. Juin J. Liou
Member
University of Central Florida, USA
Prof. Mitsu Koyanagi
Member
Tohoku University, Japan
Prof. Jin Goo Park
Member
Hanyang University, Korea
Dr. Hsing-Huang Tseng
Member SEMATECH, USA
Conference Chairmen
Dr. Tomi Li
Chairman Applied Materials, Inc., USA
Dr. Qingyuan Han
Co-Chairman Axcelis Technologies, Inc., USA
Prof. Hiroshi Iwai
Co-Chairman Tokyo Institute of Technology, Japan
Dr. Fei Xu
Co-Chairman GSMC, China
Executive Committee
Dr. Tomi Li
Chairman
Applied Materials, Inc., USA
Dr. Qingyuan Han
Co-Chair
Axcelis Technologies, Inc., USA
Prof. Hiroshi Iwai
Co-Chair
Tokyo Institute of Technology, Japan
Dr. Fei Xu
Co-Chair
GSMC, China
Dr. Swami Mathad
Secretary
S/C Tech. Consulting, USA
Dr. Hanming Wu
Member
SMIC, China
Dr. David P. Huang
Member

Praxair , USA

Prof. Cor Claeys
Member
IMEC, Belgium
Dr. Sowmya Krisnan
Member
Ultra Clean Technology, USA
Dr. Tim Turner
Member
Chiron Technology, USA

Dr. Qiang Wu

Member

HHNEC, China

Dr. Youfan Liu

Member

Intel , USA

Dr. Qinghuang Lin

Member

IBM , USA

Dr. Simon Chang
Member
Texas Instruments, USA
Dr. David Sheng
Member
TSMC
 
BEST STUDENT PAPER AWARD

ISTC announces its inaugural Best Student Paper A ward for the upcoming 2007 annual conference which will be held on March 18-20,2007 in Holiday Inn £¬ Pudong Shanghai P.R.China . The purpose of this Competition is to encourage the learning and researching interest in semiconductor technology, to explore the significant science meaning of the semiconductor field, to bring the potential world-class talent to the semiconductor industry, and to further improve the inter-communication between the student and the employer. T his award is to recognize the outstanding paper prepared and submitted to the conference by a full-time student.

Topic: Topic of the participating paper should be pertinent to the scopes of any of the ISTC divisions

Eligible Participants: full time students, including PhDs , Master and BS students;

Application Procedure:

1. A 250-word abstract indicating which session the papers include;
2. Biography of the student;
3. A copy of the student card;
4. A recommendation letter from the student advisor;
E -mail to : ISTC2007@ecsa si a.org by October 30, 2006 ;
5. Sending out Paper acceptance notifications by November 15, 2006 ;
6. Full papers are due by December 30, 200 6 ;

Selection: ISTC student paper award committee members will review the submitted papers to appraise the technical competence, significance of findings, originality, and clarity of expression of the finalists. The winner will be informed before January 30 , 2007 and will be officially announced on Day One Conference, March 19, 2007.

Award: A check of $500 as well as a Certificate of ISTC'07 Best Student Paper will be presented by the conference chair to the winner. Special recognition will be given to the winning paper in the Conference Proceedings.

SESSIONS COMMITTEE
 
Division I Advanced Processing
Chairman
Hanming Wu SMIC, China
Co-Chairman
Ruiping Wang Applied Materials, Inc., USA
Co-Chairman
Qingyuan Han Axcelis Technologies, Inc., USA
Member

Yu-Long Jiang

Fudan University, China

Member

Chenting Lin

ECI Technology, USA

Division II CMP
Chairman
David P. Huang Praxair Inc., USA
Co-Chairman
Wei-Chung Yu Rohm & Haas, USA
Co-Chairman
Dr. Fei Xu GSMC, China
Member
Dr. Gary Ding Intel. USA
Member
Renhe Jia Applied Materials, Inc., USA
Member
Uday Mahajan KLA Tencor, USA
Member
Srini Raghavan Intel / University of Arizona , US
Division III Device, Modeling, & Reliability
Chairman
Cor Claeys IMEC, Belgium
Co-Chairman
Ru Huang Peking University, China
Co-Chairman
Prashant Majhi Sematech, USA
Member
Dr. Waism Wong SMIC
Member
Sunil Wickramanayaka Anelva Corporation, Japan
Member
Albert Wang Illinois Institute of Technology, USA
Member
Summer Tseng SMIC, China
Division IV Equipment and Materials
Chairman
Sowmya Krisnan UCT, USA
Co-Chairman
Wei Chen Dow Corning, USA
Co-Chairman
Masayasu Tanjyo Nissin, Japan
Member
Jack Kuo LAM Research, USA
Division V Manufacturing Science
Co-Chairman
Kazuya Ohuchi
Toshiba, Japan
Co-Chairman
David Sheng TSMC
Member
H. K. Lin SMIC, China
Member
Tom Fu Chartered
Division VI Photolithography
Chairman
Qiang Wu HHNEC, China
Co-Chairman
Zewen Liu Tsinghua University,China
Co-Chairman
Odd Hung Chartered, Singapore
Member
Qinghuang Lin IBM, USA
Member
Simon Chang Texas Instruments, USA
Member
Hooi Soon Ellipsiz Ltd, Singapore
Division VII Packaging and Assembly
Chairman
Youfan Liu Intel, USA
Co-Chair
Howard Li Applied Materials, USA
Co-Chair
Dr. Ivy Qin K&S
     
 
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