| Chairman: |
Dr. Qiang Wu, ASML |
| Co-Chairman: |
Dr. Shuji Ding, Rohm & Haas Electronics Material |
| Committee Members: |
Dr. Zewen Liu, Tsinghua University |
| Dr. Zhibiao Mao, Toppan Shanghai |
| Dr. Qinggang Li, SMIC |
| Dr. Gary Zhang, Rohm & Haas Electronics Material |
 |
March 16 |
| 13:00-13:05 |
Chairman Address |
| |
Dr. Qiang Wu, ASML |
| 13:05-13:25 |
Invited:Topological and Model Based approach to Pitch decomposition for Double Patterning |
| |
Peter Nikolsky, ASML |
| 13:25-13:45 |
Invited:Current Status of Immersion Exposure Tool |
| |
Takashi Masuyuki, Nikon |
| 13:45-14:05 |
Invited:Applying Inverse Lithography Technology (ILT) to Develop the Best Lithography Strategy & Design Rules for Advanced Technology Nodes |
| |
Linyong Pang, Luminescent Technologies, Inc |
| 14:05-14:25 |
Invited:Impact of Pattern Dependent Photoacid Diffusion to the Process Window under Low k1 Conditions |
| |
Lei Wang, HHNEC |
| 14:25-14:45 |
Invited:Novel Developer-Soluble Anti-Reflective Coatings for 248-nm Lithography |
| |
Ramil Mercado, Brewer Science, Inc |
| 14:45-15:05 |
Invited:Status and challenges of template fabrication process for UV nanoimprint lithography |
| |
Masaaki Kurihara, DNP |
| 15:05-15:25 |
Coffee Break |
| 15:25-15:45 |
Invited:An Extreme Ultraviolet Lithography Procedure for the Fabrication of Passive Crossbar Arrays |
| |
Xinhua Liu, Chinese Academy of Sciences |
| 15:45-16:05 |
Invited:BARC for Immersion and Hyper NA Process |
| |
Hisayuki Watanabe , Nissan Chemical Industries, Ltd. |
| 16:05-16:25 |
Invited:Novel registration control method with patterning induced stress release model for beyond 65nm-node lithography |
| |
Dong-II Park, Toppan Photomask Korea Ltd. |
| 16:25-16:45 |
65nm Intermetal Layer Litho Performance Optimization by Plasma Treatment |
| |
Petros An, SMIC |
| 16:45-17:05 |
Advanced Scanner focus off-line monitor with optical scatterometery |
| |
Lisa Qin, SMIC |
| 17:05-17:25 |
Study of Pattern Transfer Quality for Nano-Scale Photolithography |
| |
Jing-Jou Tang, Southern Taiwan University |
| 17:25-17:45 |
Thin Wafer Processing – safe and reliable handling technologies utilized in high volume manufacturing environment |
| |
Paul Kettner, EV Group |
| 17:45-18:05 |
A Study of Overlay Measurement Limit on Substrates with Varying Signal Qualities |
| |
Ying Zhang, HHNEC |
March 17 |
| 08:00-08:20 |
Invited:Hyper NA Imaging in Multilayer Systems |
| |
George Lu, Rohm & Haas |
| 08:20-08:40 |
Study on major contributions to OPC inaccuracy in 180-nm technology node |
| |
Kim Wan Ho, X-FAB Sarawak Sdn. Bhd |
| 08:40-09:00 |
Method for in-situ measuring even aberrations of projection optics in lithographic tools by use of optimized phase-shifting marks |
| |
Qiongyan Yuan, Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences |
| 09:00-09:20 |
Invited:Molecular Glass Photoresists Based on Acidolysis of Acetal Compounds |
| |
Liyuan Wang, Beijing Normal University |
| 09:20-09:40 |
MEEF-driven Defect Disposition for Contamination Inspection Challenges |
| |
Tracy Huang, KLA-Tencor |
| 09:40-10:00 |
Coffee Break |
| 10:00-10:20 |
Post Etch Overlay in Through Wafer Deep Reactive Ion Etching |
| |
Henk van Zeijl, Delft Institute of Microelectronics and Submicron Technology |
| 10:20-10:40 |
Influence of Substrates and Pretreatment on Adhesion Contact Angle as a Method for Litho Process Improvement |
| |
Xiaobo Guo, X-FAB Sarawak Sdn. Bhd |
| 10:40-11:00 |
Formulating for Extreme PR-Stripping, Achieving Performance, Selectivity, and Stability |
| |
John Moore, Daetec, LLC |
| 11:00-11:20 |
Controlling Resist Residue Defects at I-Line Poly Layer |
| |
Ng Wah Hoo, X-FAB Sarawak Sdn. Bhd |
