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ISTC2008 AGENDA
Symposium F. Packaging, Assembly and Test
Chairman: Dr. Youfan Liu, Intel, USA
Co-Chairmen: Dr. Xinyu Dou, Tsinghua University, China
Committee: Dr. Ivy Wei Qin, Kulicke & Soffa Industries, USA
March 17
13:00-13:05 Chairman Address
  Youfan Liu, Intel, USA
13:05-13:35 Packaging of Silicon Carbide Power Semiconductor Devices
  Simon Ang, University of Arkansas
13:35-14:05 Innovative Bonding Tool Design for Fine Pitch Copper Wire Applications
  Gur Giyora, Kulicke & Soffa Bonding Tools
14:05-14:35 Comparing Measurement Methods for InterMetallic Coverage
  Tomer Levinson, Kulicke & Soffa Bonding Tools
14:35-15:05 Microstructural Evaluation of Al-Cu Interfaces in Wire-Bonding
  M. Drozdov, Technion
15:05-15:30 Coffee Break
15:30-16:00 Process Optimization for Ultra-fine Pitch Wire Bonding
  Horst Clauberg, Kulicke & Soffa Industries
16:30-17:00 Thermal Aging Study at 150 ≧ and 200 ≧ :Gold Ball Bonds to Aluminum Bond Pad
  M.K.Md Arshad, University Perlis Malaysia
     
 
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