| |
Conference Chairman
|
| Dr. Qingyuan Han |
Conference Chairman |
Hans Consulting International |
| Conference Co-Chairman |
| Prof. Hiroshi Iwai |
Conference Co-Chairman |
Tokyo Institute of Technology, Japan |
| Dr. Hanming Wu |
Conference Co-Chairman |
SMIC, China |
| Dr. David P. Huang |
Conference Co-Chairman |
Praxair, USA |
| Executive Committee |
| Dr. Ming Yang |
ECS-Asia Chairman |
IC Spectrum, Chairman&CEO, China |
| Dr. Qingyuan Han |
Conference Chairman |
Hans Consulting International |
| Prof. Hiroshi Iwai |
Conference Co-Chairman |
Tokyo Institute of Technology, Japan |
| Dr. Hanming Wu |
Conference Co-Chairman |
SMIC, China |
| Dr. David P. Huang |
Conference Co-Chairman |
Praxair, USA |
| Dr. Ru Huang |
Treasurer |
Peking University, China |
| Dr. Swami Mathad |
Secretary |
S/C Tech. Consulting, USA |
| Prof. Cor Claeys |
Symposium A Chairman |
IMEC, Belgium |
| Prof. Yuhua Cheng |
Symposium B Chairman |
Peking University, China |
| Dr. Qiang Wu |
Symposium C Chairman |
ASML, China |
| Dr. Hanming Wu |
Symposium D Chairman |
SMIC, China |
| Dr. David P.Huang |
Symposium E Chairman |
Praxair, USA |
Dr. Youfan Liu
|
Symposium F Chairman |
CASPA Phoenix, USA |
| Dr. Qinghuang Lin |
Symposium G Chairman |
IBM, USA |
International Advisory Committee |
| Dr. Ming Yang |
Chairman |
IC Spectrum, Chairman&CEO, China |
Prof. Hiroshi Iwai |
Member |
Tokyo Institute of Technology, Japan |
Dr. Simon Deleonibus |
Member |
CEA-LETI, France |
Prof. Juin J. Liou |
Member |
University of Central Florida, USA |
|
Member |
|
Dr. Hsing-Huang Tseng |
Member |
SEMATECH, USA |
|
Member |
S/C Tech. Consulting, USA
|
| Prof. Cor Claeys |
Member |
IMEC, Belgium |
| Dr. Dan Gamota |
Member |
Motorola, USA |
| Committee Members |
| Symposium A: Device and Reliability |
| Dr. Cor Claeys |
Chairman |
IMEC, Belgium |
| Prof. Ru Huang |
Co-Chairman |
Peking University, China |
| Dr. Prashant Majhi |
Co-Chairman |
Sematech, USA |
| Dr. Waisum Wong |
Member |
SMIC |
| Dr. Sunil Wickramanayaka |
Member |
Anelva Corp., Japan |
| Dr. Albert Wang |
Member |
Illinois Institute of Technology |
| Dr. Summer Tseng |
Member |
SMIC |
| Prof. Ru Huang |
Co-Chairman |
Peking University, China |
| Symposium B: Design for Manufacturing(DFM) |
| Prof. Yuhua Cheng |
Chairman |
Peking University, China |
| Dr. Charles Chiang |
Co-Chairman |
Synopsys, USA |
| Prof. David Pan |
Member |
University of Texas at Austin, USA |
| Dr. Li-Fu Chang |
Member |
SMIC, China |
| Prof. Kuen-Yu Tsai |
Member |
National Taiwan University |
| Prof. Ting-Chi Wang |
Member |
Natinal Tsing Hua University |
| Symposium C: Photolithgraphy |
Dr. Qiang Wu |
Chairman |
ASML, China |
Dr. Shuji Ding |
Co-Chairman |
Rohm & Haas Electronics Material |
Dr. Liu Zewen |
Member |
Tsinghua University, China |
Dr. Mao Zhibiao |
Member |
Toppan, Shanghai |
Dr. Qinggang Li |
Member |
SMIC, China |
Dr. Gary Zhang
| Member
| Rohm & Haas Electronics Material
|
| Symposium D: FEOL&BEOL Advanced Processing
|
| Dr. Hanming Wu
| Chairman
| SMIC, China
|
| Dr. Sowmya Krisnan
| Co-Chairman
| Ulta Clean Technology, USA
|
| Dr. Jian Ding
| Member
| Northern Microelectronics Center, China
|
| Dr. Ruiping Wang
| Member
| Applied Materials,Inc, USA
|
| Dr. Chenting Lin
| Member
| ECI Technology, USA
|
| Dr. Jack Kuo
| Member
| LAM Research, USA
|
| Symposium E: CMP & Post-CMP Cleaning
|
Dr. David P. Huang |
Chairman |
Praxair Inc., USA |
|
Co-Chairman |
Intel Corp & University of Arizona, USA
|
|
Member |
|
|
Member |
CMP.Rohm & Haas Electronic Materials Inc, USA |
|
Member |
Applied Materials Corp., USA
|
|
Member |
KLA Tencor , USA |
| Symposium F: Packaging and Assembly |
| Dr. Youfan Liu |
Chairman |
CASPA Phoenix, USA |
| Dr. Xinyu Dou |
Co-Chairman |
Tsinghua University, China |
| Dr. Ivy Wei Qin |
Member |
Kulicke & Soffa Industries, USA |
| Symposium G: Emerging Technology |
| Dr. Qinghuang Lin |
Chairman |
IBM, USA |
| Dr. Ebrahim Andideh |
Co-Chairman |
Intel, USA |
| Dr. Jie Zhang |
Member |
Motorola, USA |
| |
|