We are soliciting papers from authors around the world on all the aspects of semiconductor technology and manufacturing, including semiconductor Frond-End-of-the-Line (FEOL), Back-End-of-the-Line (BEOL), packaging as well as silicon materials.
ISTC/CSTIC is intended to be the largest annual international conference on semiconductor technology and manufacturing in China. It aims to provide a platform for executives, managers, engineers and researchers to exchange the latest developments in semiconductor technology and manufacturing. It also offers an opportunity for those who are interested in investing in the semiconductor industry in Asia, particularly in China.
Topics to be addressed at ISTC/CSTIC 2009 include, but not limited to the following:
Symposium I: Design and Device Engineering
Symposium II: Metrology, Reliability and Testing
Symposium III: New Materials and Process Integration
Symposium IV: Photolithography
Symposium V: CMP & Cleaning
Symposium VI: Thin Film, Etch and Plating
Symposium VII: Packaging Technology
Symposium VIII: Emerging Semiconductor Technologies
Symposium IX: Silicon Technology for Semiconductor, Electronic and Solar Applications
Prospective authors are requested to submit an abstract of 200-250 words and a 100 word biography by Jan. 20, 2009. Abstract submit between Nov. 10 to Jan. 20, 2009 might not have paper published in ECS Transaction and conference proceeding. The abstract must clearly describe the nature, scope, content, organization, key points and significance of the proposed paper, using SEMI templates on the website.
Presentations are to be original, non-commercial in that they focus on the technical merits of a design, a method, a structure, an integration scheme, a material or a process rather than on the individual company¡¯s product benefits. All abstracts will be reviewed by ISTC/CSTIC 2009 committees. Selected speakers will be notified no later than Jan. 25, 2008.
Manuscripts of three to six pages including diagrams, figures, and photographs, are to be submitted electronically via the conference website or e-mail. The deadline for manuscript submittal is Jan. 6, 2009. English oral presentation materials are required by Feb. 1, 2009. Accepted papers for publication in conference proceedings are subject to co-copywriter with SEMI, who reserves the right to republish, re-sell, and display submitted material in whole or in part.
DOCUMENTS
ISTC/CSTIC2009 Call for papers (PDF 150KB) |
